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Application Notes Applications Fundamental Research Octiv Mono 2.0 Octiv Poly 2.0 Octiv Suite 2.0 Process Performance

Bias potential measurement with Octiv VI probe during atomic layer etching of SiO2 and Si3N4 with Low Global Warming C4H3F7O Isomers

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Application Notes Applications Octiv Mono 2.0 Octiv Poly 2.0 Octiv Suite 2.0 RF Match unit Characterization

Utilizing Impedans Octiv VI Probes for Characterization of RF Matching Networks

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Application Notes Octiv Suite 2.0 Process Performance Semion 2500 V4

Effect of substrate biasing on the ion properties of a magnetron sputtering system using Impedans’ Semion RFEA System and Octiv Suite 2.0 VI Probe

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Application Notes Octiv Mono 2.0 Octiv Poly 2.0 Octiv Suite 2.0 Semion 2500 V4 Tool Characterization

Measurements of plasma produced by Inductively coupled array (INCA) with Impedans’ Langmuir Probe, Semion RFEA System and Octiv VI Probe

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Application Notes Model Validation Octiv Suite 2.0

Measurement of DC self bias and Ion flux using Impedans Octiv VI probe during plasma polymerization process in an asymmetric capacitively coupled plasma

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Application Notes Fundamental Research Octiv Suite 2.0 Semion 2500 V4 Tool Characterization

The magnetic asymmetry effect in geometrically asymmetric RF capacitively coupled plasmas, characterized with Impedans’ Octiv Suite 2.0 VI probe and Semion RFEA system

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Application Notes Fundamental Research Langmuir Probe Octiv Suite 2.0

AImpedans Langmuir Probe and Octiv Suite are used to study the time dependencies of pulsed inductively coupled Ar and Ar/CF4 discharges

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Application Notes Moduli RF Spectrometer Octiv Poly 2.0 Octiv Suite 2.0 Process End Point Detection

Application of the Impedans Moduli RF Spectrometer for Detecting Clean and Small Open Area Etch Endpoints through RF Harmonic Emission from Plasma

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Application Notes Octiv Suite 2.0

Ion flux measurements using Octiv VI probe in RF Plasma Polymerisation of Furfuryl Methacrylate (FMA)

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Application Notes Octiv Suite 2.0

Ion flux measurements using Octiv VI Probe to study the deposition rates in plasma polymerization process